| PART |
Description |
Maker |
| 449-10-208 449-10-208-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 449-10-210 449-10-210-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-103-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-105-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-102-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 414-43-272-41-117000 |
Interconnect Socket .100 Grid; Surface Mount Socket Stub Tail Double Row Surface Mount Accepts .015-.025" Leads
Interconnect Socket .100 Grid; Surface Mount Socket Stub Tail Double Row Surface Mount Accepts .015-.025 Leads
|
Mill-Max Mfg. Corp.
|
| SD-71308-001 0713085460 |
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| SD-70287-003 |
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| 90627-0761 0906270761 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, with Kinked PC Tail
2.54mm (.100") Pitch C-Grid III垄芒 Header, Single Row, Vertical, with Kinked PC Tail
|
Molex Electronics Ltd.
|
| 90136-2210 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 829-22-004-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-019-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
